Endura 5500 >
Centura 5200 / 5300 >
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BEST is a Leading Supplier of Refurbished Applied Materials® Equipment and Service for the Semiconductor Industry.

BEST offers completely refurbished Applied Materials® Etch, CVD and PVD systems at a significant savings over the cost of a new unit, without sacrificing quality. All of our refurbished systems are guaranteed to meet or exceed the original published manufactured specifications. All of these systems include installation and warranty.

BEST can supply many configurations of the Endura 5500, Centura 5200 / 5300 and P5000. System mainframe types are: RTP (Rapid Thermal Process), DCVD (Dielectric CVD), WCVD (Tungsten CVD), Tungsten Etch Back and Dielectric Etch. This also includes configuring your system to your specific wafer size with a variety of options.

Take a look and see what BEST can offer you.

 

Applied Materials<sup>®</sup> Endura 5500
             
Endura PVD Processes
Standard Aluminum (Al)
Planarized Hot Aluminum
(HTHU)
Standard Titanium (Ti)
Coherent Titanium (Coh Ti)
Dedicated Titanium Nitride (TiN)
Titanium / Titanium Nitride (TTN)
Coherent Titanium / Titanium Nitride (Coh TTN)
Titanium Tungsten (TiW)
Tungsten (W)
Endura Chambers
Standard Body Chamber
Wide Body PVD Chamber
Water Cooled PVD Chamber
Paste Chamber (Ch-5)
Preclean I / II chamber
Orienter / Degas Chamber
PVD Degas Chamber
Vectra IMP
Endura System Options
Specific Wafer Size Configuration
Wide or Narrow Body Load Locks
HP Motorized Lifts
Single or Dual Orienter / Degas Chambers
HP, HP+ or VHP Robots
Fast Wafer Mapping
Buffer / Transfer Lid Hoist
3Phase or Enhanced Cryopumps
Through-the-Wall or Ballroom Style Installation

Applied Materials<sup>®</sup> Centura 5200/5300
             
Centura Processes
ASP
Sputter Etch
Oxide Etch
Poly Etch
Nitride Etch
DPS Poly or Metal Etch
HDP-CVD
TEOS, Doped / Undoped
WCVD
WSiX
RTP
PVD
SACVD
Centura Chambers
ASP+
Sputter Etch
MxP
MxP+
eMxP+ and Super eMxP+
DPS, R0/R1
WxP
DxZ
WxZ
HDP
RTP (Mod 1), RTPxe
Universal CVD
Preclean II chamber
Orienter / Degas Chamber
Single / Multi Slot Cool Down Chamber
Centura System Options
Phase II Mainframe
Centura II
High Temp Mainframe
Narrow or Wide Body Loadlock
Chambers
On The Fly Center finder (OTF)
Fast Wafer Mapping
HP, HP+ or VHP Robots
Transfer Lid Hoist
High Optical Throughput Endpoint System (H.O.T.)
Monochromator Endpoint
Through the wall or Ballroom Style Installation

Applied Materials<sup>®</sup> Precision 5000
             
P5000 Processes
ASP
Sputter Etch
Oxide Etch
Poly Etch
Nitride Etch
Metal Etch
TEOS, Doped / Undoped
WCVD
WSiX
SACVD
P5000 Chambers
ASP
Mark II
MxP, MxP+
MxP+ Poly
WxP
DxZ
WxZ
Universal CVD
WCVD
Orienter Chamber
P5000 System Options
Mark II Mainframe
8, 15, or 29 slot storage Elevator
Phase III Robot and Cassette Handler
Phase IV Hotbox
PLIS
Wafer Position System (W.P.S.)
High Optical Throughput Endpoint System (H.O.T.)
Monochromator Endpoint
Through-the-Wall or Ballroom Style Installation
Standard or Modular Remote Frame